Plasma Treatment to Create a Hydrophilic Surface on Silicon Substrates
Ohio Pen/10268259

TEMPE, Ariz. - OhioPen -- Recent testing: initial contact angles of 45 degrees to 75 degrees were measured.  After plasma treatment in our AutoGlow 1000 the contact angle was measured < 2 degrees. Testing performed in the AutoGlow 1000 production plasma cleaner.

Plasma Treatment is used to modify silicon wafer surface properties, specifically targeting hydrophilicity. This process involves exposing the silicon substrate to a low-pressure plasma environment, typically utilizing gases such as oxygen or argon/hydrogen mixture. Through the interaction between plasma species and the silicon surface, a cascade of intricate chemical reactions occurs, leading to the formation of hydrophilic functional groups, primarily hydroxyl (-OH) moieties, on the surface.

The plasma-induced surface modification proceeds through sequential steps. Initially, energetic plasma species, including ions, electrons, and radicals, impact the silicon surface, breaking surface bonds--forming reactive species like silicon radicals and dangling bonds. Subsequently, these species react with surrounding gas molecules, predominantly oxygen or hydrogen, resulting in the incorporation of oxygen or hydrogen atoms onto the silicon surface.

More on Ohio Pen

• UK Financial Ltd Sets Official 30-Day Conversion Deadline for Three Exchange Listed Tokens Ahead of Regulated Upgrade
• New Jersey Therapy and Life Coaching Unveils Original Dan Fenelon Mural in Voorhees New Jersey Therapy Office
• Pataskala, Ohio Olde Town Holiday Cookie Walk 2025
• Kentucky Judges Ignore Evidence, Prolong Father's Ordeal in Baseless Case
• Contracting Resources Group Receives 2025 HIRE Vets Platinum Medallion Award from the U.S. Department of Labor

The introduction of these functional groups, notably hydroxyl (-OH) groups, alters the silicon wafer's surface chemistry, rendering it hydrophilic. Hydroxyl groups exhibit a strong affinity for water molecules due to their polar nature, facilitating water adsorption and enhancing surface wetting. This transition, from hydrophobic to hydrophilic surfaces, holds significant importance in various technological domains, notably microfluidics, where precise control over surface wettability is vital for fluid manipulation and bioanalytical applications.  Also important for bonding applications.

In semiconductor manufacturing, plasma treatment is particularly relevant for enhancing adhesion between silicon surfaces and functional layers like dielectric films or photoresists, thereby improving device performance and reliability. Moreover, the ability to tailor surface properties at the nanoscale level enables the fabrication of advanced nanostructures and surface patterns, paving the way for the development of innovative electronic and photonic devices.

More on Ohio Pen

• Crunchbase Ranks Phinge Founder & CEO Robert DeMaio #1 Globally. Meet him in Las Vegas-Week of CES to Learn About Netverse, Patented App-less Platform
• IODefi Introduces New Web3 Infrastructure Framework as XRP Ledger Development Gains Global Attention
• Terizza Forms Strategic Collaboration with UC San Diego to Pioneer Next-Generation Distributed AI Infrastructure
• EnergyStrat Launches Global LNG Risk Outlook 2025–2030
• Strong Revenue Gains, Accelerating Growth, Strategic Hospital Expansion & Uplisting Advancements: Cardiff Lexington Corporation (Stock Symbol: CDIX)

Plasma treatment emerges as a sophisticated methodology, offering unparalleled precision in tailoring silicon wafer surfaces. Our test show results to increase the hydrophilic surfaces to reducing contact angles.  Plasma treatment plays a pivotal role in various applications such as increasing bonding strength.

Testing was performed on the AutoGlow 1000 plasma system configured for RIE and Direct Plasma.