VORAGO Technologies announces family expansion and size reduction of radiation-hardened Arm® Cortex® MCUs into BGA packages for Defense and Aerospace
Ohio Pen/10070596

AUSTIN, Texas - OhioPen -- VORAGO Technologies (https://voragotech.com) today announced the expansion of the highly integrated Radiation-Hardened Arm^® Cortex^® Microcontroller (MCU) family into Ball Grid Array packages. This announcement promises an increase of functionality options spanning size and scope while incorporating the company's patented HARDSIL^® technology.

"As the space market transitions into smaller electrical designs, the need for a reduction in Size Weight and Power, or SWaP, of the components building those systems need to follow suit. The introduction of the VORAGO family of BGA processors allows the functionality of up to 8 ICs to be compressed down into one tiny 12x12mm BGA package." – Jason Wells, Director of Product Management, VORAGO Technologies

More on Ohio Pen

• Georgia's Magical Nights of Lights Bigger and Brighter for 2026
• Harvard Educated Board Certified Endodontist Joins Pearlfection Dentistry
• NYC Banners Delivers High-Stakes UN General Assembly Backdrop for the US Department of State Event
• OneVizion Appoints Energy Infrastructure Executive Walt Farrell to Board of Directors
• Tampa Bay Reporter Launches with a Mission to Deliver Local News with National Reach

The expansion of packages for VA416XX and VA108X0 offers unprecedented choice in a marketplace dominated by limited, less-flexible legacy components. These new additions to the broader family of Arm^® Microcontroller products from VORAGO drastically reduce the design footprint while offering more flexibility with applications in hi-rel, aerospace, military and defense.

VA416XX and VA108X0 family of products include the following features and benefits:

• High performance Arm^® Cortex^® processing power with easy-to-use programming tools
• Optional integrated NVM to take up less real estate
• Pin-to-pin compatibility across family of MCUs
• 12x12mm BGA package increasing available board space
• Full Latch-up immunity and TID up to 300 krad (Si) utilizing VORAGO's patented HARDSIL^® technology
• Broad range of communication interfaces (I²C, UART, CAN, SPI, Ethernet, Spacewire)
• Easy-to-design development kit, with exceptional support and service offerings available
• To learn more or request a datasheet, visit VORAGO's Product Page.

About VORAGO Technologies

More on Ohio Pen

• "JACKIE the STRIPPER," Starring Charlotte Kirk and The PUSSYCAT DOLLS' Kimberly Wyatt, Now Streaming on PRIME
• Migguel Anggelo Celebrates the Immigrant Experience, Latino Identity, and the Power of Iconic Latin Rhythms During Hispanic Heritage Month
• Artsman Launches Fall Gifting Promotion on Game-Used Court Collectibles
• Indianapolis Criminal Defense Firm Rigney Law LLC Relaunches Criminal Law Podcast "Tales from the Brown Desk"
• 3ptechies Makes Its Articles Audio-Ready With Instaread Voice Technology

VORAGO Technologies is a privately held, high technology company based in Austin, Texas with over 14 years of experience in providing radiation-hardened and extreme-temperature solutions for the Hi-rel marketplace. VORAGO's patented HARDSIL^® technology uses cost-effective high-volume manufacturing to harden any commercially designed semiconductor component for extreme environment operation, and has created a number of solutions throughout Aerospace, Defense and Industrial applications. VORAGO Technologies opens up a new world of possibilities for your designs, no matter how hostile the environment. www.voragotech.com